- BY BRAND
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TAPES
FILAMENT & STRAPPING TAPES
- 3M™ Filament Tapes
- tesa® Filament/Strapping Tapes
- Cross Weave Filament Tapes
- Mono Weave Filament Tapes
- Tensilised Polypropylene Strapping Tapes
- White Goods/ Appliance Strapping Tapes
3M™ Dual Lock™ Reclosable Fastener SJ3550, nOW BACK IN STOCK - ASK US FOR PRICES NOW! -
ADHESIVES
- Acrylic Adhesives
- Adhesive Applicators & Mixing Nozzles
- Aerosol Spray Adhesives
- Anaerobic Adhesives and Sealants
- Cyanoacrylate (Instant) Adhesives
- Epoxy Adhesives
- Hot Melt Adhesives
- Liquid Adhesives
- Polyurethane Adhesives
- Sealants
- Primers & Adhesion Promoters
- Surface Preparation Products
- UV Light Curable Adhesives
- Water Based Adhesives
3M™ Scotch-Weld™ Low Odour Acrylic Adhesives are two-part, 1:1 mix ratio, toughened structural adhesives with less odour than most acrylic adhesives. -
PACKAGING
tesa® self adhesive paper packaging tape from well managed FSC® certified forests.
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Abrasives
3M™ Cubitron™ II Hookit™ Clean Sanding Film Disc 775L, cuts up to two times faster and lasts up to six times longer than conventional abrasives.
- WORKWEAR
- JANITORIAL
Bondloc B3293 Black 3 Minute PU Adhesive x 50ml
Fast setting, room temperature cure polyurethane adhesive Has excellent adhesion to a wide variety of substrates and can be sanded once cured.
- Mix Ratio : 1:1
- Colour : Black
- Viscosity : Paste
- Tensile Strength : 15N/mm2
- Working Time : <3 mins
- Fixture Time : <30 mins
- Supplied with 1x mixing nozzle per cartridge
- Also available in 400ml cartridge
Please refer to product data sheet for further information
STRUCTURAL ADHESIVES
Bondloc structural adhesives utilise a wide range of resin bases in order to provide end users with the best possible product for each individual application. One of the key factors of modern designs and engineering processes is the desire to produce unique products that will distinguish you from your competitors. Our innovative range of high-strength structural adhesives are fully compatible with modern manufacturing processes and allow for even greater flexibility in component design
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